RO4533 High Frequency PCB - Rogers 20mil 30mil 60mil Antenna RF PCB for Cellular and WiMAX Applications
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The RO4533 High Frequency PCB is a high-performance printed circuit board designed for antenna applications, utilizing Rogers Corporation's RO4533 laminates. This ceramic-filled, glass-reinforced hydrocarbon-based material is engineered to meet the specific demands of the antenna market. With a dielectric constant (Dk) of 3.3 and a low loss tangent (Df) of 0.0025 at 10 GHz, the RO4533 PCB allows antenna designers to achieve substantial gain while minimizing signal loss. It is an affordable alternative to traditional PTFE antenna technologies, offering an optimal balance of price and performance.
The RO4533 material's resin system is designed to provide ideal antenna performance, with coefficients of thermal expansion (CTEs) in the X and Y directions closely matching that of copper. This CTE match reduces stress in the printed circuit board, ensuring reliable performance in demanding applications.
Features and Benefits
1.Low Loss (0.0025) and Low Dk (3.3): Ideal for high-frequency applications with minimal signal loss.
2.Low PIM Response: Ensures excellent passive intermodulation performance, critical for mobile infrastructure.
3.Thermoset Resin System: Compatible with standard PCB fabrication processes.
4.Excellent Dimensional Stability: Provides greater yield on larger panel sizes.
5.Uniform Mechanical Properties: Maintains structural integrity during handling and assembly.
6.High Thermal Conductivity: Improves power handling capabilities.
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Typical Applications
1.Cellular Infrastructure Base Station Antennas 2.WiMAX Antenna Networks
Our PCB Capability (RO4533)
| PCB Capability (RO4533) | |
| PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
| Designation: | RO4533 |
| Dielectric constant: | 3.3 |
| Dissipation Factor | 0.0025 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold etc.. |
RO4533 Typical Values
| Property | RO4533 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0025 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 11 | Y | ||||
| 37 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.9 （1.2） | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |